MultiPlaQ - development and characterization of a multi layer quartz glass board for RF applications

The aim of the cooperation project is to build a multilayer circuit board made of quartz for high-frequency applications. For this purpose, quartz wafers are perforated and conformally copper-plated. This electroplating layer is structured on both sides. The production of intermediate layers is made possible by joining the two-layer boards. High-frequency characterization, calibration structures, modelling and specification of the RF properties are important components of the project. Such a multilayer quartz board with through-hole contacts closes existing gaps in the development of new high-frequency technology applications, especially from 10 to 100 GHz, which will enable modern components and assemblies with increasing demands on their high-frequency properties in the future. The planned demonstrator offers the opportunity to present these new types of quartz circuit boards to potential customers and introduce them to the market.